Pace Technology, Inc. - An API Nanotronics Company

Careers

Career Opportunities

The People of PTI are our company's most valuable asset. Our environment is conducive to personal growth and career enhancement. Every employee is a member of the PTI team and is personally involved in the commitment to supply quality products to our customers. It is through the efforts of all employees that our success will be realized.

Listings by Job Title:

Senior Research and Development Engineer

Develop, implement, maintain and improve manufacturing processes for the hybrid microelectronics and optoelectronics packaging industry, from product conception and planning through production and release. Conduct research into thick film refractory materials for microelectronic packaging. Design & develop thin and thick film circuits including optoelectonic products and manufacturing fixtures. Develop processing techniques (thick & thin film) to improve product yield. Develop sealing techniques for Microelectronic/Optoelectronic packages (glass/ceramic & ceramic/metal) using Vacuum Brazing and Sealing Glasses. Employ Design-for-Manufacturing techniques on new and existing processes and recommend and prepare changes, additions, and modifications, which will facilitate manufacturing. Design tests and test fixtures and evaluate test data to determine appropriate limits and variables for manufacturing processes. Generate process characterization documentation to demonstrate manufacturing process capabilities and process controls. Publish work and prepare presentations. Utilize advanced knowledge in: 1) ceramic to glass seals, vacuum brazing, die and wire bonding on thick and thin film ceramic; 2) microwave technology and semiconductor device physics of optoelectronic devices and device processing; 3) reliability, thermal, material and mechanical aspects of semiconductor packages; 4) material properties associated with refractory materials, thick and thin film materials and processes, particularly related to providing high yield and reliable products. Apply technical troubleshooting and project management skills. Use DOE, SPC, ISO9000, MIL-STD-883.Job Requirements:
  • 6 years experience in the job offered or in thick film manufacturing of complex hybrid microelectronic, optoelectronic and high power packaging.
  • 4 years experience in thin film manufacturing (Wet etching, Thin film deposition)
  • MS degree in process-related field such as EE, ME, Materials Science or Physics.

Please mail all resumes to:

Pace Technology,Inc.

8020 114th Ave. N.

Largo, Florida 33773

Attention: Harry

 

 
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